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| (R) STTH5R06 TURBO 2 ULTRAFAST HIGH VOLTAGE RECTIFIER Table 1: Main Product Characteristics IF(AV) VRRM Tj VF (typ) trr (max) FEATURES AND BENEFITS 5A 600 V 175C 1.4 V 40 ns K A K A TO-220AC STTH5R06D TO-220FPAC STTH5R06FP Ultrafast switching Low reverse recovery current Low thermal resistance Reduces switching losses K K A NC NC A DESCRIPTION The STTH5R06, which is using ST Turbo 2 600V technology, is specially suited as boost diode in continuous mode power factor corrections and hard switching conditions. This device is also intended for use as a free wheeling diode in power supplies and other power switching applications. Table 2: Order Codes Part Number STTH5R06D STTH5R06FP STTH5R06B Marking STTH5R06D STTH5R06FP STTH5R06B D2PAK STTH5R06G DPAK STTH5R06B Part Number STTH5R06B-TR STTH5R06G STTH5R06G-TR Marking STTH5R06B STTH5R06G STTH5R06G Table 3: Absolute Ratings (limiting values) Symbol Parameter VRRM Repetitive peak reverse voltage IF(RMS) IF(AV) RMS forward voltage TO-220AC / TO-220FPAC / D2PAK DPAK Average forward current TO-220AC / DPAK Tc = 135C = 0.5 / D2PAK TO-220FPAC Tc = 105C = 0.5 Surge non repetitive forward current tp = 10ms sinusoidal Storage temperature range Maximum operating junction temperature REV. 4 Value 600 20 10 5 5 50 -65 to + 175 175 Unit V A A IFSM Tstg Tj A C C 1/9 September 2004 STTH5R06 Table 4: Thermal Resistance Symbol Rth(j-c) Junction to case Parameter TO-220AC / DPA / D2PAK TO-220FPAC Table 5: Static Electrical Characteristics Symbol IR * VF ** Parameter Test conditions VR = VRRM 25 IF = 5A 1.4 Min. Typ Max. 20 250 2.9 1.8 V Unit A Reverse leakage current Tj = 25C Tj = 125C Forward voltage drop Tj = 25C Tj = 125C Pulse test: ** tp = 380 s, < 2% To evaluate the conduction losses use the following equation: P = 1.164 x IF(AV) + 0.128 IF (RMS) * tp = 5 ms, < 2% Value (max). 3.0 5.5 Unit C/W 2 Table 6: Dynamic Characteristics Symbol trr IRM Parameter Reverse recovery time Reverse recovery current Reverse recovery charges Forward recovery time Forward recovery voltage Tj = 25C Tj = 25C IF = 5A dIF/dt = 40 A/s VFR = 1.1 x VFmax IF = 5A dIF/dt = 40 A/s VFR = 1.1 x VFmax Tj = 25C Test conditions IF = 0.5A Irr = 0.25A IR =1A IF = 1A dIF/dt = -50 A/s VR =30V Tj = 125C IF = 5A VR = 400V dIF/dt = -200 A/s 5.0 0.35 110 150 4.5 nC ns V Min. Typ Max. Unit 25 40 6.0 A ns S factor Softness factor Qrr tfr VFP Figure 1: Conduction losses versus average current P(W) 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0 1 2 3 4 5 =1 = 0.05 = 0.1 = 0.2 = 0.5 Figure 2: Forward voltage drop versus forward current IFM(A) 50 45 40 35 30 25 20 15 Tj=25C (maximum values) Tj=125C (typical values) Tj=125C (maximum values) T 10 IF(AV)(A) =tp/T 6 5 tp 0 7 0 1 2 3 VFM(V) 4 5 6 2/9 STTH5R06 Figure 3: Relative variation of thermal impedance junction to case versus pulse duration (TO-220AC, DPAK, D2PAK) Zth(j-c)/Rth(j-c) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 Single pulse = 0.2 = 0.1 = 0.5 Figure 4: Relative variation of thermal impedance junction to case versus pulse duration (TO-220FPAC) Zth(j-c)/Rth(j-c) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 = 0.2 = 0.1 = 0.5 T 0.2 0.1 T 0.1 0.0 1.E-03 1.E-02 tp(s) 1.E-01 =tp/T tp 0.0 1.E+00 Single pulse tp(s) 1.E-02 1.E-01 =tp/T 1.E+00 tp 1.E+01 1.E-03 Figure 5: Peak reverse recovery current versus dIF/dt (90% confidence) IRM(A) 22 20 18 16 14 12 10 8 6 4 2 0 0 200 400 600 800 1000 IF=0.25 x IF(AV) IF=0.5 x IF(AV) IF=IF(AV) VR=400V Tj=125C Figure 6: Reverse recovery time versus dIF/dt (90% confidence) trr(ns) 80 IF=2 x IF(AV) VR=400V Tj=125C 70 60 50 40 30 20 10 IF=2 x IF(AV) IF=IF(AV) IF=0.5 x IF(AV) dIF/dt(A/s) dIF/dt(A/s) 0 0 200 400 600 800 1000 Figure 7: Reverse recovery charges versus dIF /dt (90% confidence) Qrr(nC) 350 300 250 200 150 IF=0.5 x IF(AV) IF=IF(AV) VR=400V Tj=125C Figure 8: Softness factor versus dIF/dt (typical values) S factor 0.70 0.65 0.60 IF=IF(AV) VR=400V Tj=125C IF=2 x IF(AV) 0.55 0.50 0.45 0.40 0.35 0.30 0.25 0.20 100 50 dIF/dt(A/s) 0 0 200 400 600 800 1000 0.15 0.10 0 200 dIF/dt(A/s) 400 600 800 1000 3/9 STTH5R06 Figure 9: Relative variations of dynamic parameters versus junction temperature Figure 10: Transient peak forward voltage versus dIF/dt (90% confidence) VFP(V) 20 2.50 18 2.25 2.00 1.75 1.50 1.25 1.00 0.75 0.50 0.25 0.00 25 50 75 100 125 QRR IRM S factor IF=IF(AV) Tj=125C 16 14 12 10 8 6 4 Tj(C) IF=IF(AV) VR=400V Reference: Tj=125C 2 0 0 100 dIF/dt(A/s) 200 300 400 500 Figure 11: Forward recovery time versus dIF/dt (90% confidence) tfr(ns) 120 IF=IF(AV) VFR=1.1 x VF max. Tj=125C Figure 12: Junction capacitance versus reverse voltage applied (typical values) C(pF) 100 F=1MHz VOSC=30mVRMS Tj=25C 100 80 60 40 20 dIF/dt(A/s) 0 0 100 200 300 400 500 10 1 10 VR(V) 100 1000 Figure 13: Thermal resistance junction to ambient versus copper surface under tab (epoxy FR4, eCU=35m) (DPAK and D2PAK) Rth(j-a)(C/W) 100 90 80 70 60 50 40 30 20 10 0 0 2 4 6 8 10 12 14 16 18 20 S(Cu)(cm) 4/9 STTH5R06 Figure 14: DPAK Package Mechanical Data REF. A A1 A2 B B2 C C2 D E G H L2 L4 V2 DIMENSIONS Millimeters Inches Min. Max Min. Max. 2.20 2.40 0.086 0.094 0.90 1.10 0.035 0.043 0.03 0.23 0.001 0.009 0.64 0.90 0.025 0.035 5.20 5.40 0.204 0.212 0.45 0.60 0.017 0.023 0.48 0.60 0.018 0.023 6.00 6.20 0.236 0.244 6.40 6.60 0.251 0.259 4.40 4.60 0.173 0.181 9.35 10.10 0.368 0.397 0.80 typ. 0.031 typ. 0.60 1.00 0.023 0.039 0 8 0 8 Figure 15: DPAK Foot Print Dimensions (in millimeters) 6.7 6.7 3 3 1.6 2.3 2.3 1.6 5/9 STTH5R06 Figure 16: D2PAK Package Mechanical Data DIMENSIONS Millimeters Inches Min. Max. Min. Max. 4.40 4.60 0.173 0.181 2.49 2.69 0.098 0.106 0.03 0.23 0.001 0.009 0.70 0.93 0.027 0.037 1.14 1.70 0.045 0.067 0.45 0.60 0.017 0.024 1.23 1.36 0.048 0.054 8.95 9.35 0.352 0.368 10.00 10.40 0.393 0.409 4.88 5.28 0.192 0.208 15.00 15.85 0.590 0.624 1.27 1.40 0.050 0.055 1.40 1.75 0.055 0.069 2.40 3.20 0.094 0.126 0.40 typ. 0.016 typ. 0 8 0 8 REF. A E L2 C2 D L L3 A1 B2 B G A2 C R M * V2 * FLAT ZONE NO LESSTHAN 2mm A A1 A2 B B2 C C2 D E G L L2 L3 M R V2 Figure 17: D2PAK Foot Print Dimensions (in millimeters) 16.90 10.30 1.30 5.08 3.70 8.90 6/9 STTH5R06 Figure 18: TO-220FPAC Package Mechanical Data REF. A H B Dia L6 L2 L3 L5 D F1 L4 L7 F G1 G E A B D E F F1 F2 G G1 H L2 L3 L4 L6 L7 Dia. DIMENSIONS Millimeters Inches Min. Max. Min. Max. 4.4 4.6 0.173 0.181 2.5 2.7 0.098 0.106 2.5 2.75 0.098 0.108 0.45 0.70 0.017 0.027 0.75 1 0.030 0.039 1.15 1.70 0.045 0.067 1.15 1.70 0.045 0.067 4.95 5.20 0.195 0.204 2.40 2.70 0.094 0.106 10 10.4 0.393 0.409 16 Typ. 0.63 Typ. 28.6 30.6 1.126 1.204 9.8 10.6 0.385 0.417 15.9 16.4 0.626 0.645 9.00 9.30 0.354 0.366 3 3.20 0.118 0.126 Figure 19: TO-220AC Package Mechanical Data DIMENSIONS Millimeters Inches Min. Max. Min. Max. 4.40 4.60 0.173 0.181 1.23 1.32 0.048 0.051 2.40 2.72 0.094 0.107 0.49 0.70 0.019 0.027 0.61 0.88 0.024 0.034 1.14 1.70 0.044 0.066 4.95 5.15 0.194 0.202 10.00 10.40 0.393 0.409 16.40 typ. 0.645 typ. 13.00 14.00 0.511 0.551 2.65 2.95 0.104 0.116 15.25 15.75 0.600 0.620 6.20 6.60 0.244 0.259 3.50 3.93 0.137 0.154 2.6 typ. 0.102 typ. 3.75 3.85 0.147 0.151 REF. H2 C L5 OI L6 L2 D L7 A L9 F1 L4 F G M E A C D E F F1 G H2 L2 L4 L5 L6 L7 L9 M Diam. I 7/9 STTH5R06 Table 7: Ordering Information Ordering type STTH5R06D STTHR5R06G STTHR5R06G-TR STTHR5R06FP STTHR5R06B STTHR5R06B-TR Marking STTH5R06D STTH5R06G STTHR5R06G STTHR5R06FP STTHR5R06B STTHR5R06B-TR Package TO-220AC D2PAK D2PAK TO-220FPAC DPAK DPAK Weight 1.90 g 1.48 g 1.48 g 1.70 g 0.3 g 0.3 g Base qty 50 50 1000 50 75 2500 Delivery mode Tube Tube Tape & reel Tube Tube Tape & reel Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.8 m.N. (TO-220FPAC) / 0.55 m.N. (TO-220AC) Maximum torque value: 1.0 m.N. (TO-220FPAC) / 0.70 m.N. (TO-220AC) Table 8: Revision History Date Oct-2002 07-Sep-2004 Revision 3 4 Description of Changes Last update Tcases values splitted for TO-220FPAC package 8/9 STTH5R06 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. 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